A compact placement system with the placement rate of 47500 cph, and flexibility to place components ranging from 0201(0603mm) chip to 100x26mm connector.

An option exists for the placement of 01005 (0402mm) chip components.

• One work cell (stage) assembles one board at a time.
• X and Y axes are operated by linear motors.
  The Y axis has two motors for enhanced stability and repeatibility.
• Two placement heads have up to 12 nozzles each.
• On-the-fly recognition of all components.
• A line sensor on each head checks for component presence, orientation, and correct thickness.
• Unique board conveyor system moves both rails for optimum board postioning during production.
  No more "fixed rails"!!!

Range of components

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Machine Layout

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• One work cell (stage) assembles one board at a time.
  • A stage has two gantries (beams) each with one placement head.
    The two heads within the stage work cooperatively.
    While one head is picking components, the other is placing.

• X and Y axes are operated by linear motors.
  The Y axis has two motors for enhanced stability and repeatibility.
  • Both X and Y axes use linear scale encoders for the most accurate and repeatable positioning.

• Two placement heads have up to 12 nozzles each.
  • The high speed head holds 12 nozzles.
    Nozzle stockers contain additional nozzles that are available for exchange during production.
    Nozzle stockers are easily detached for off-line setup.

High Speed Head

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Removable Nozzle Stockers

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• On-the-fly recognition of all components.
  • Recognition of components is achieved while the beams are moving at full speed.
    No stopping or slow-down is necessary.

Component Recognition Camera

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• A line sensor on each head checks for component presence, orientation, and correct thickness.
  • The line sensor also checks for variations in component thickness and an offset is generated for proper placement.

Line Sensor

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Multi-Tray Feeder

• Components are picked up directly from tray.
• Two magazines hold 15 trays each for a total of 30 JEDEC trays available at any time.
• The trays in one magazine can be replenished while the other is being used to run production without stopping the machine.

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Shuttle Tray Feeder

• A tray fed component solution with minimal loss of tape feeder capacity.
• Components are shuttled to the pick-up position.
• Two magazines hold 10 trays each for a total of 20 JEDEC trays available at any time.
• The trays in one magazine can be replenished while the other is being used to run production without stopping the machine.

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Tape Splicing

• Near empty feeders can be refilled without stopping the machine or removing the feeder.
• A sensor in the feeder detects the splice and the machine resets the low component count condition.

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Multi-Function Head

• Places larger components: from 1206 (3216mm) up to 55X55mm square and 100X26mm rectangular.
• Nozzles are interchangeable with a dedicated nozzle stocker.

Multi Function Head

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Recycle Conveyor

• Rejected components that are on the large side or those that are easily damaged are set on a flat conveyor belt, instead of in a bin with chip components.
• The reject conveyor can be easily activated without stopping the machine to bring the components to an accessible point for reclamation.
• Up to four recycle conveyors can be installed (one for each block).

Lead Coplanarity Check

• A laser system is used to detect lifted leads - both gull wing and 'J' leads.
• Also checks BGA's for partially detached solder balls.

Additional Nozzle Stocker Bases

• Up to four nozzle stocker bases can be installed within each block depending on nozzle size.
• Nozzle stocker bases operate the nozzle housing, the removable section that holds the nozzles.

Component Library Teach

• Acquires all necessary data and adds new components to the library after entering a minimal amount of information.
• Components can be tested using the recognition system to verify data.

Placement Position Teach

• Adjustments to placement X-Y data in the pattern program can be made while viewing either a bare board or a populated board.
• Offsets for repeat pattern programs can be taught in a similar manner as described above.

Flux Dispenser

• Dispenses a film of flux for the placement of flip chips.
• A multi-function head must be installed to utilize this unit.

PC Board Height Feedback

• Uses a laser to determine true board height at placement position.
• Prevents damage to components by adjusting the nozzle level to compensate for board height variations.

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