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Hitachi High Technologies America, Inc.

Hitachi

SiP Bonder

DB-800

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DB-800HS
SiP Bonder

SMT Quotation/Information Request

  • 300mm Die Bonder - Engineered for High Speed Sip Assembling

    Laser length measurement combined with mechanical dispenser results in high percision paste application utilizing non-contact nozzle height control

    Thermo-pressure bonding is achieved by substrate heater/collet heater use

    Superb Thin Die handling by means of ultrasonic and multi-stage pickup

Item Description
Bonding Speed 0.32sec/die cycle time
Bonding Accuracy X-Y: ±15μm
θ: ±0.5° (3σ)
Work Dimensions Lead Frame Width: 25-90mm Length: 100-250mm
Wafer 300mm standard; 200mm optional
Die 0.8x0.8m-25x25mm optional
Dimensions 1,900Wx1,430Dx1,600H(mm)
Weight 1,600kg
  • Thin die pickup is achieved with ultrasonic and multi-stage pickup.
  • High precision paste application with non-contact nozzle in a mechanical dispenser. Height is controlled by laser length measurement.
  • Different thermo-pressure bonding mounting by using a substrate heater / collet heater.

 

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