Hitachi’s New 8000-Series Dry Plasma Etcher
Hitachi's New 8000-Series Plasma Etch Platform
- 4 Etch/Ash Chambers
- 300mm Wafer Size
- FOUP
- Fully Flexible Chamber Flow Programming
- Dedicated Load/Unload Ports
- Fully AGV, OHV Capable
Hitachi’s newest platform is the 8000-Series for ultra-high volume manufacturing. The platform is designed specifically for sub-45nm technology nodes and can incorporate four chambers in any configuration of etch and ash systems.
The 8000-Series platform is designed to work with the Microwave ECR XT etch chamber or the UHF ECR etch chamber.
