Hitachi's 600-Series Dry Plasma Etcher

• Microwave ECR/EMCP Chamber Options
• High-Volume Production Capability
• 2 Etch Chambers
• 2 Ash Chambers
• Factory Integration
• 125mm – 200mm Wafer Size
• Open Cassette Interface
• Fully Flexible Chamber Flow Programming
• Dedicated Load/Unload Ports

Hitachi’s 600-Series platform is Hitachi’s multi-chamber platform based on the 500-Series etch system. The platform incorporates two etch chambers and two optional ash chambers. Similar to the 500-Series, the 600-Series provides a three-wafer cassette interface with separate load and unload locks.

The platform delivers high-volume production that leverages the 500-Series’ superior etch capability. The 600-Series platform can be configured with either the Microwave ECR etch chamber or the non-volatile EMCP etch chamber.