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Hitachi High Technologies America, Inc.

Hitachi

HD-2700 Cs-Corrected FE-STEM

Spherical Aberration Corrected Scanning Transmission Electron Microscope HD-2700

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Spherical Aberration Corrected Scanning Transmission Electron Microscope HD-2700

Electron Microscope and Focused Ion Beam Contact Form

The HD-2700 is the top-of-the-range STEM featuring optional spherical aberration correction developed in collaboration with CEOS GmbH to offer significantly improved resolution and analytical sensitivity. By correcting the spherical aberration, resolution of less than 0.1 nm can be achieved in dark-field STEM mode.  The HD-2700 is ideally suited for R&D and QC applications in materials science, semiconductors and nanotechnology.

The Cs corrector is field retrofittable for any HD-2700 system that was originally ordered without the Cs corrector. For the electron source the user has the choice between either Schottky Emission or Cold Field Emission.

High-speed, high-sensitivity EDX analysis (solid angle greater than 0.3sr) is possible since the HD-2700 has 10x greater probe current than other models in the HD-series. This allows extremely rapid acquisition of elemental distribution images even for elements at low concentrations. It is possible to mount dual EDX detectors onto the HD-2700 column for even higher sensitivity EDX analysis. Electron Energy Loss Spectrometry is also available for analysis of light elements with enhanced spatial resolution.

Extremely versatile imaging allows simultaneous multiple-image acquisition and display with a wide variety of combinations including SE/BF, SE/DF, BF/DF, DF/EDX and DF/EELS.

The HD-2700 enjoys the same simplicity of operation as other HD-series models and has the same sample holder, which is fully compatible with the Hitachi FB-2100 Focused Ion Beam System, ensuring seamless interchange between the instruments.

 

Image Resolution

w/o Cs-corrector:

  • 0.204 nm guaranteed (at a magnification of ×4,000,000)

w/ Cs-corrector:

  • 0.144 nm guaranteed (at a magnification of ×7,000,000)(Std. lens)
  • 0.136 nm guaranteed (HAADF image)
  • 0.105 nm guaranteed (by FFT)(at a magnification of ×7,000,000)(HR lens(*))
Magnification ×100 – ×10,000,000
Accelerating voltage 200 kV, 120 kV (*)
Video signal

Bright field STEM: Phase contrast image (TE image)

Dark field STEM: Z-contrast image (ZC image)

Secondary electron image (SE image)

Electron diffraction(*)

Characteristic X-ray analysis and mapping(EDX)(*)

EELS analysis and mapping(EV3000)(*)
Electron optics

Electron source: Schottkey emitter or Cold field emitter (*)

Illumination lens system: 2-stage condenser lens

Cs-corrector(*): Hexapole transfer lens design

Scanning coil:  2-stage electromagnetic coil

ZC collection angle control: Projector lens design

Electromagnetic image shift: ±1 μm
Specimen stage

Specimen movement: X/Y = ±1 mm, Z= ±0.4 mm

Specimen tilt: Single-tilt holder: ±30° (Std. lens), ±18° (HR lens(*))
Vacuum system

Ion pump ×3, TMP ×1

Ultimate vacuum: 10-8 Pa (Electron gun), 10-5 Pa (Specimen chamber)
Image display

PC/OS: PC/AT compatible, Windows® XP

Monitor: 19-inch LCD

Image frame size: 640 × 480, 1,280 × 960, 2,560 × 1,920 pixels

Scan speed: TV, Slow (0.5 to 320 s/frame)

Auto data display: Recording No., accelerating voltage, micron bar Magnification, date, time
(*) Optional

 

High resolution STEM imaging

  • HAADF-STEM image 0.136nm, FFT image 0.105nm (HR lens(*))
  • HAADF-STEM image 0.144nm (Std. lens)
  • BF STEM image 0.204nm (w/o Cs-corrector)

High-speed & high-sensitivity EDX analysis: Probe current x 10 times

 

  • Elemental mapping in more rapid timely manner
  • Low-concentration element detection

Simplified operation

  • Automatic image alignment function

Seamless solution from sample preparation to observation & analysis.

  • Holder compatibility with Hitachi FIB

Versatile evaluation & analysis function with various options

  • Simultaneous acquisition & display of SE&BF, SE&DF, BF&DF, DF/EDX mapping(*) and DF/EELS mapping(*) images.
  • Low Dose function(*) (minimizing electron beam damage & contamination of specimen)
  • High precision magnification calibration & measurement(*)
  • Live diffraction unit(*) (Simultaneous observation of DF-STEM image and Diffraction pattern)
  • Automatic tilt-series image acquisition function using 3D micro-pillar rotation holder (360°rotation)(*)
  • ELV-3000 Real-time Elemental mapping system(*) (simultaneously acquired with DF-STEM image)

(*) Optional

Application Notes

Literature

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