GXH-3 Modular Mounter

Product Number: GXH-3

• Components are picked up directly from tray.
• Two magazines hold 15 trays each for a total of 30 JEDEC trays available at any time.
• The trays in one magazine can be replenished while the other is being used to run production without stopping the machine.

• A tray fed component solution with minimal loss of tape feeder capacity.
• Components are shuttled to the pick-up position.
• Two magazines hold 10 trays each for a total of 20 JEDEC trays available at any time.
• The trays in one magazine can be replenished while the other is being used to run production without stopping the machine.

• Near empty feeders can be refilled without stopping the machine or removing the feeder.
• A sensor in the feeder detects the splice and the machine resets the low component count condition.

• Places larger components: from 1206 (3216mm) up to 55X55mm square and 100X26mm rectangular.
• Nozzles are interchangeable with a dedicated nozzle stocker.

• Rejected components that are on the large side or those that are easily damaged are set on a flat conveyor belt, instead of in a bin with chip components.
• The reject conveyor can be easily activated without stopping the machine to bring the components to an accessible point for reclamation.
• Up to four recycle conveyors can be installed (one for each block).

• A laser system is used to detect lifted leads - both gull wing and 'J' leads.
• Also checks BGA's for partially detached solder balls.

• Up to four nozzle stocker bases can be installed within each block depending on nozzle size.
• Nozzle stocker bases operate the nozzle housing, the removable section that holds the nozzles.

• Acquires all necessary data and adds new components to the library after entering a minimal amount of information.
• Components can be tested using the recognition system to verify data.

• Adjustments to placement X-Y data in the pattern program can be made while viewing either a bare board or a populated board.
• Offsets for repeat pattern programs can be taught in a similar manner as described above.

• Dispenses a film of flux for the placement of flip chips.
• A multi-function head must be installed to utilize this unit.

• Uses a laser to determine true board height at placement position.
• Prevents damage to components by adjusting the nozzle level to compensate for board height variations.