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> XT Chamber
XT Chamber for 32nm Node Technology
printable version
XT Chamber for 32nm Node Technology
Industry Leading Etch Uniformity
Co-Axial Chamber Advantages
Benefits of High Speed Evacuation
M-712XT Process Performance
ECR Plasma Processing Advantages
M-712XT Technolgy
ECR Plasma Processing Advantages
Plasma Position Controlled by process recipe
ECR height can be varied by adjusting coil currents
Chamber Inner walls can be effectively cleaned by plasma sweeping
XT Chamber for 32nm Node Technology
Etch Systems
700 Series
UHF-ECR Chamber
Microwave ECR Chamber
SCDS PFC Abatement System
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