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starting of breadcrumb Semiconductor Equipment Division  > Products > XT Chamberending of breadcrumb
 

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XT Chamber for 32nm Node Technology
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XT Chamber for 32nm Node Technology

 
Industry Leading Etch Uniformity
Co-Axial Chamber Advantages
Benefits of High Speed Evacuation
M-712XT Process Performance
ECR Plasma Processing Advantages
M-712XT Technolgy


 

Benefits of High Speed Evacuation

 
(a)
P=0.4 Pa
Q=140sccm
(b)
P=0.2 Pa
Q=140sccm

(c)
P=0.2 Pa
Q=280sccm

Lower etch by-product density delivers excellent CD uniformity!

 
 
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XT Chamber for 32nm Node Technology

Etch Systems

700 Series

UHF-ECR Chamber

Microwave ECR Chamber

SCDS PFC Abatement System
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