 | | XT Chamber for 32nm Node Technology |
Industry Leading Etch Uniformity
Hitachi introduces the new XT etch chamber designed specifically to meet the rigorous challenges facing etch for 45nm and 32nm node IC technologies. The perfectly symmetrical XT chamber design combined with high conductance co-axial pumping and Hitachi's high density microwave ECR plasma source redefines the limits of etch uniformity.
Hitachi XT Chamber Advantages
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- Uniform reactive gas & by-product distribution
- Ultra low pressure operation
- Smaller chamber volume
- Less chamber surface area
- Fewer consumable parts
- Reduced wet cleaning times
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