UHF-ECR Chamber

Dielectric layers have become much more critical to device yield and performance as designers push the envelope of speed and size. New HARC, SAC, and Low-k processes are much more demanding of equipment capability and performance. Hitachi engineers are meeting these challenges in the design of the Hitachi UHF ECR etch chamber. The new U-Chamber takes advantage of Hitachi’s wealth of etch experience in the semiconductor industry and combines it with the production-proven 700 Series platform. The U-700 offers superior performance for dual damascene, high aspect ratio and self-aligned contact, via, pad, spacer, and hard mask definition processes with industry leading selectivity, reliability, and productivity.