 | | SMI-ED Multi-layer ceramic and plastic packages |
Overview
Sumitomo Metal Electronic Devices, Inc., (SMI-ED) manufactures multi-layer ceramic packages suitable for subscriber (up to 10G) and trunkline (up to 40G) applications.
8 lead mini-DIL
- 14 lead butterfly
- GPO package
- Plastic Packages
- Responding to the increased need for higher frequency and higher power devices, SMI-ED utilizes a variety of simulation and evaluation tools to optimize package design. Dimensional stability and hermetic reliability are obtained through consistently reproducible production methods.
Hitachi High Technologies America is SMI-ED's sales and marketing representative for North America.
Advantages:
- Electrical Simulation (e high frequency signal transmittable characteristics)
- Stress Simulation (e stress analysis between lens and low melting temperature glass solder during the lens attachment process)
- Thermal Characterization and Modeling
Applications: