 | | Semiconductor Packaging |
Overview
Product Summary:
Hitachi High Technologies America provides technical and sales/marketing support for laminate-based semiconductor package manufactures in Japan. Products include fine pitch solutions in small form factors with low to mid I/O packages (CSP) to multi-layer thermally enhanced high I/O packages (BGA). Recent developments include ultra-thin semiconductor packaging for multi-media applications, such as Smart Media and Secure Digital Cards.
Product Category:
- CSP Products
- Finished substrate thickness (min.): 0.13 ± 0.03mm
- Ball Counts: 16 - 196
- BGA Products (P-BGA, E-BGA, Flip-Chip BGA, etc.)
- Body Sizes: 19 x 19mm - 45 x 45mm
- Ball Counts: 168 - 900
- Other Products
- Smart Media Cards
- SD Cards
- LCD Drivers