Information and manufacturing needs are undergoing tremendous change as the speed, capacity, and capability of electronics and information infrastructures increase.
Technological innovation in semiconductors and component packaging continues to increase the complexity and density of electronic components and assemblies, while decreasing the size of components and electronic assemblies. At the same time, there is a never-ending global demand for lower cost. These are the primary parameters that guide this division of Hitachi High Technologies. The Electronics Applied Systems Division (EASD) offers optimal integrated manufacturing solutions to our large and small customers by supplying a variety of cutting-edge surface mount technology manufacturing solutions.
The Electronics Applied Systems Division provides complete, innovative, global manufacturing solutions to the world’s electronic OEMs (original equipment manufacturers) and contract manufacturing companies. EASD offers a complete hardware and software product line that includes solder paste printers, glue dispensers, high speed electronic component chip mounters, flexible placement machines, associated hardware, and complete manufacturing software solutions.
In order to meet the ongoing requirements of the surface mount technology industry, the Electronics Applied Systems Division is committed to putting easy-to-use systems into the hands of its customers. With the acquisition of Sanyo High Technologies, we have a long history of innovative design and development combined with excellence in sales, marketing, and service. We have created a true market leader that is constantly moving forward into the future. Guided by the objectives of “pursuit of total productivity” and “development of advanced mounting process technology,” HTA’s Electronics Applied Systems Division presents the best in global manufacturing solutions for the electronics industry.