Technological innovation in semiconductors and component packaging continues to increase the complexity and density of electronic components and assemblies, while decreasing the size of components and electronic assemblies. At the same time, there is a never-ending global demand for lower cost. These are the primary parameters that guide this division of Hitachi High Technologies. The Electronics Applied Systems Division (EASD) offers optimal integrated manufacturing solutions to our large and small customers by supplying a variety of cutting-edge surface mount technology manufacturing solutions.

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